7300LSI
In-line XRD, HRXRD, and XRR
7300LSI
The 7300LSI automated diffractometer is designed for in-fab R&D and in-line production process monitoring of semiconductor films on full wafers. It is the tool of choice for the characterization of materials used in advanced logic and memory, as well as GaN/Si chip making. Expanding upon the 7300L base model, 7300LSI offers multiple modes in one tool (X-ray reflectivity, high-resolution XRD, grazing-incidence XRD, and wide-angle XRD) for strain metrology, thin film characterization, and phase analysis on blanket wafers. Optional S and I channels add µHRXRD and in-plane diffraction capabilities. Full automation ensures a productive and user-friendly solution for everything from measurement configuration switches and alignment to operation, analysis, and reporting.
High-Resolution, High-Throughput Wafer Handling and Analysis
7300LSI features industry-leading control and analysis and a host of unique features to speed your time to accurate and repeatable results. It provides full wafer mapping for all sizes and automates handling and alignment of standard and transparent substrates. The system's robust and intuitive analysis software streamlines sample analysis flow, from alignment to report, and enables RADS for HRXRD and REFS for XRR.
The highest resolution is provided by:
- High-resolution goniometer
- Choice of optics and detectors, optimized for the application
High throughput is guaranteed by:
- High flux source
- Automated wafer handling for 300, 200, and 150mm wafers
- Wafer handling from a choice of load ports: FOUP, SMIF, Open Cassettes
- Recipe-driven tool configuration changes, including crystals and slits
- Fab automation through SECS/GEM
Full Automation for Production Monitoring
7300LSI's versatile X-ray diffractometer provides multiple techniques for analyzing and monitoring thin films:
- HRXRD — strain, thickness, composition of epitaxial layers
- XRR — thickness, roughness, density of thin films and stacks
- XRD (grazing incidence/wide angle) — phase, crystallinity, texture, residual stress
- In-plane XRD — phase, crystallinity of ultrathin films
Tailored Performance for Advanced Applications
The 7300LSI system is utilized worldwide in advanced nodes logic and memory fabs.
Key applications include:
- Characterization of epitaxial films for advanced logic chips
- High-K thickness, density, and crystallinity for DRAM and NAND
- GaN on Si for power transistors
- Advanced materials for future node development
All applications are enabled by our comprehensive analytical software suite for analysis, simulation, and fit: RADS and REFS.
Enhanced Capabilities to Fit Your Fab
S Channel
The S channel offers small spot measurements of test structures on patterned wafers, with a spot size of 50x50µm at the sample. The channel can be either configured as a high-resolution beam, for strain measurements with µHRXRD on epitaxial layers, or as a µXRD beam for phase, crystallinity, and orientation measurements on crystalline films. The S channel comes with fully automated pattern recognition.
I Channel
Phase and orientation monitoring on ultra-thin crystalline films is enabled with the optional I channel for in-plane XRD measurements.
Support
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.