FilmTek 2000M TSV Robotic
FilmTek 2000M TSV
The FilmTek™ 2000M TSV is a fully automated metrology tool that utilizes non-destructive optical technology to measure film thickness, through-silicon via (TSV) depth, trench depth, CD, residual silicon, and total thickness variation (TTV) applications in both front-end and advanced packaging development. Based on proprietary data processing and patented hardware that achieves a very small measurement spot size with a nearly collimated beam, the FilmTek 2000M TSV is a highly valuable tool for both semiconductor manufacturing or research and development facilities.
Measurement Capabilities
Enables determination of:
- TSV etch depth for via structures with diameters greater than 1 µm up to a maximum etch depth of 500 µm.
- Height or depth
- Critical dimensions
- Film thickness
System Components
Standard:
- Measure high aspect ratio TSV structures
- Measure TSV etch depth up to 500 µm
- Measure TSV structures with diameter down to 1 µm
- Patented FilmTek technology
- Fast measurement time (~1 second per point)
- TSV etch depth, bump height, critical dimension, and film thickness metrology in a single tool
- Cassette to cassette wafer handling
- Brooks or SCI automation
- 300mm, FOUP, and SMIF compatible
- SECS/GEM
Typical Application Areas
Advanced Packaging
Measure the complete range of back-end manufacturing and process control packaging parameters.
FilmTek process control solutions enable fully automated measurements for thick resist thickness for bump coplanarity, high-aspect-ratio TSV depth and top CD for interconnects, bonded silicon thickness or Total Thickness Variation (TTV), and thin metal-oxide thickness in bonding processes to prevent non-wet open failures.
Typical application areas include:
- TSV metrology
- Advanced semiconductor packaging
Technical Specifications
| Measurement Function |
TSV etch depth, bump height, critical dimension, and film thickness |
|---|---|
| Wafer Handling | Brooks or Bruker |
| Substrate Size | 200 or 300 mm |
| Pattern Recognition | Cognex |
| CD Precision (1σ) | <0.2% |
| Etch Depth Precision (1σ) | <0.005% |
| Film Thickness Range | 5 nm to 350 µm (5 nm to 150 µm is standard) |
| Film Thickness Precision (1σ) | <0.005% |
| Light Source | Halogen lamp |
| Detector Type | 2048 pixel Sony linear CCD array |
| Computer | Multi-core processor with Windows™ 10 Operating System |
| Wafer Throughput | >60 WPH |
Comparison of Via Etch Depth by FilmTek 2000M TSV and SEM
| Via Diameter | SEM | FilmTek 2000M TSV |
|---|---|---|
| 5 µm | 44.5 µm | 44.3 µm |
| 10 µm | 55.5 µm | 55.5 µm |
| 15 µm | 62.0 µm | 61.8 µm |
| 20 µm | 66.5 µm | 66.8 µm |
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.
Contact Us About the FilmTek 2000M TSV Robotic System
Ask us a question, request more information, or get in touch with a Bruker sales representative.