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FilmTek 2000M TSV Brochure

Learn more about our fully-automated, non-destructive metrology tool for TSV, CD, TTV, and film thickness measurements

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If you have questions about any of our products or services, please contact us.
You can also email us for more information at productinfo@bruker.com.

If you would like to connect with a Bruker representative immediately, contact our regional offices at:

Asia: +65 6540 4388
China: +86 10 5833 3000
Europe: +33 172 86 61 00
Japan: +81 3 3523-6361
North America: +1 805-967-1400

FilmTek 2000M-TSV metrology platform for CD metrology and advanced film measurements in advanced packaging applications

FilmTek 2000M TSV Robotic

Spectroscopic reflectometry system offers optimized metrology for front-end and advanced packaging applications, from film thickness, TSV and trench depth to CD, residual silicon, and TTV measurements.

- Film thickness range: 5nm – 2000µm
- Spectral range: 400 nm – 1700 nm
- Spot size: as small as 1x2 µm

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