Hysitron TI 990 TriboIndenter

The Hysitron TI 990 TriboIndenter achieves remarkable advances in control and throughput capabilities, testing flexibility, applicability, measurement reliability, and system modularity — enabling more and better research than previously possible.

Bruker's next-generation Hysitron TI 990 TriboIndenter® sets new standards for performance, flexibility, and usability in nanomechanical and nanotribological characterization. A comprehensive advancement of Bruker’s industry-leading TriboIndenter platform, every aspect of TI 990's measurement and analysis process features updated technologies designed to remove the normal limitations of nanoindenter systems. As such, this system features the most measurement modes available and delivers high-precision measurements in the broadest range of laboratory environments.

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Unmatched

performance and capabilities

Takes fullest advantage of latest advances in Performech III control, nanoDMA IV testing, and XPM II ultra-high speed property mapping.

Unlimited

modular system

Enables world's largest and most expandable suite of advanced nanomechanical techniques.

Maximum

measurement control and ease-of-use

Simplifies system setup, operation, and analysis with all-new TriboScan 12 software.

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Features

Powerful Base Configuration

Hysitron TI 990 TriboIndenter base model configuration

Dual piezo scanners for in-situ SPM imaging
High-resolution, color optics
Exclusive low-noise 2D capacitive transducer
Metrology-grade granite framing for test stability
Integrated active anti-vibration system
Performech III controller
Vibration-dampening base with 50x improved noise immunity
Multi-layered environmental isolation enclosure
Top-view sample-chuck imaging
Property mapping with XPM II ultrahigh-speed nanoindentation
Dynamic nanoindentation
Modular enclosure with customizable panels
Universal sample chuck
High-precision, motorized/automated stage with 60% more testable area

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Applications

No System Has More Testing Modes

With its enhanced measurement capabilities, increased sample flexibility, easier system setup, and more streamlined operation, TI 990 is an unrivalled characterization solution for a variety of applications.

Whether you need improved accuracy for polymer thin films, increased throughput for combinatorial materials science, or multi-measurement analysis of full 300-mm semiconductor wafers, TI 990 keeps up with your dynamic testing needs.

Nanoindentation

Obtain force versus displacement curves to quantitatively characterize the mechanical properties of small volumes of material. The combination of the unique capacitive transducer design, tightly controlled calibration standards, and precisely machined probes produces reliable measurements of reduced modulus, hardness, and more on any material.

Nanoscratch

Understand tribological characteristics or adhesion properties by combining a normal load with lateral displacement of the probe. In addition to force and displacement data collection, TI 990 can incorporate post-scratch in-situ scanning probe microscopy (SPM) imaging of the sample with nanometer resolution for immediate topographic results.

Nanowear

Conduct tribometer-like experiments at the nanoscale by sliding a scratch probe in a reciprocating motion while monitoring force and displacement both normally and laterally. Our two-dimensional capacitive transducer technology enables high-sensitivity friction maps to be acquired as a function of number of cycles, applied normal force, wear depth, and lateral displacement.

In-Situ SPM Imaging

Directly correlate sample topography images with nanomechanical and nanotribological characterization data. The TI 990's nanometer-precision test placement accuracy ensures your image and data are colocalized, enabling both pre- and post-test SPM imaging to avoid surface defects, correlate phases with properties, and analyze deformation behavior.

XPM II

Quickly map mechanical properties while maintaining high measurement resolution and accuracy. The high-bandwidth electrostatically actuated transducer, fast control and data-acquisition electronics, and top-down in-situ SPM imaging combine to produce quantitative nanomechanical property maps and property distribution statistics in record time.

nanoDMA IV with CMX

Conduct nanoscale dynamic mechanical analysis to examine properties as a function of indentation depth, frequency, and time. Bruker's CMX control algorithms provide a quantitative and truly continuous measurement of mechanical properties, including hardness, storage modulus, loss modulus, complex modulus, and tan delta.

Contact us to discuss your specific application, process needs, and measurement requirements.

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Upgrade Options and Add-Ons

Expand TI 990's Capabilities

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Contact us for more information about available upgrade options and how TI 990 can be configured to meet your specific measurement needs now and grow with your research going forward.

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