光罩修复方案

Extreme Lithography Cleaner

第二代光罩干洗系统

生产CO₂低温颗粒(CO₂ Cryogenic Particle)去除污染

Extreme Lithography Cleaner (EL-C)

EL-C®系统广泛适用于各种应用场景,包括清除生产及处理过程中沉积在上表面和背面的颗粒,尤其适合清楚由其他设备引入的颗粒污染物。EL-C® 采用干式清洁方法,全程无污染。光罩可根据需要进行多次清洁,对直径小至50nm的软颗粒实现100%的彻底清除能效。

CO₂低温干洗
经生产验证的工艺
在全球多个先进节点工厂(包括晶圆厂和掩模板车间)执行高规格的光罩清洁工作
整个正背面
适合光学和EUV掩模版的清洁
可适应高达3:1深宽比的几何特征结构
无损
超过50+ CO₂循环清洁
专为保护脆性结构以及SRAFs ≥40nm的器件而设计,确保其免受任何形式的损伤。此外,系统的工作原理完全消除了透射和反射效应,并有效防止了吸收层的损坏。
100%
软颗粒(Soft Particle)去除效率
Features

低温气溶胶清洁原理(Cryogenic Aerosol )支持全种类光罩清洁 

在光罩的生产制造和曝光处理过程中,未知颗粒的污染持续困扰着先进节点的光罩使用。而随着光罩材料变得越来越复杂,关键尺寸不断缩小,高效、无损的清洁技术变得日益重要。

数年前,布鲁克推出了全新的光罩清洁选择——Extreme Lithography Cleaner (EL-C®) 低温干洗系统。与传统清洁技术相比,该系统不仅显著提升了软颗粒的清除效率,还极大减少了对特征结构的损害及表面再污染的风险。如今,EL-C®系统已被广泛应用于全球各个晶圆及光罩厂,助力企业实现更高标准的质量控制与生产效率。

全自动或手动上样操作 

  • SMIF & Overhead Track 兼容; RFID/OCR/条形码识别
  • SECS/GEM 兼容
  • 操作方便;高度用户友好的GUI
Applications

多类光罩清洁能力

  • EUV & Optical Front-side cleaning
  • EUV & Optical Back-side cleaning
  • Full mask clean
  • Local area (spot) clean
  • Pre-repair clean (differentiate “soft” verses “hard” defects)
  • Post-repair clean (nanomachining debris)
  • Persistent particle clean
  • Removal of adders from other equipment
  • Mask blank clean

Support

How Can We Help?

Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.

Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.

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