Production CO₂ Cryogenic Particle Removal
EL-C® systems are used for a wide variety of applications including front-side and back-side removal of particles deposited during production and handling, especially particle adders from other equipment. The EL-C process is dry and contamination free. Masks can be cleaned as often as needed with 100% soft particle removal efficiency down to 50nm sizes.
Unknown particle contamination on advanced photomasks during manufacture and mask handling in wafer fabs has been and remains a consistent problem. As mask materials become more sophisticated and geometries continue to shrink, the need for more efficient and damage free cleaning techniques has become increasingly important. Many of the older, established cleaning technologies have become less effective at soft particle removal and have become sources of feature damage and mask surface contamination. Several years ago, Bruker introduced a new mask cleaning alternative in the form of the Extreme Lithography Cleaner (EL-C®) product line of full mask cryogenic dry clean systems. The Bruker EL-C® system is now in production operation in multiple mask shops and in the mask management facilities of worldwide wafer fabs.
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.