Bruker’s automated AFMs provide proven industrial metrology solutions for surface roughness measurement, chemical mechanical planarization (CMP), and etch-depth measurements on the most current technology nodes and wafers.
Atomic Force Profiling is the most accurate, non-destructive method available for optimizing and monitoring challenging CMP and etch process steps. Direct measurements do not require test structures or models and can be peformed in the active area of the die for the best sensitivity to process variations.
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Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.