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▶ Watch On-Demand | 50 Minutes

On-Demand Session: Thermomechanical Integrity of Thin Films and Nano-Interconnects

Learn about nanoindentation-based methods to improve thermomechanical design of integrated structures

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Presented by Kris Vanstreels, Ph.D., Researcher, IMEC (March 6, 2024)

       PRESENTATION HIGHLIGHTS:

  • [00:00:00] About IMEC
  • [00:08:19] Introduction and Motivation
  • [00:11:20] Experimental Strategy for Thermo-mechanical Integrity of Thin Films and Nano-interconnects
  • [00:18:17] Indentation-Based Fracture and Adhesion of Thin Films
  • [00:34:06] Benchmarking Chip Package Interaction Integrity
  • [00:43:26] Conclusions

Q&A

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       PRESENTATION HIGHLIGHTS:

  • [00:00:24] For the wedge indentation testing, is the lamination area measurement a topographical base measurement?
  • [00:01:50] How do you calibrate your force at elevated temperatures in the indentation experiment?
  • [00:03:23] Regarding the OSG material, is that a polymer or glass?
  • [00:04:38] What efforts are required for four-point bending compared to indentation testing?

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