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Accelerating Semiconductor Processes Control with Advanced 3D Optical Metrology

Learn how recent advances in 3D Optical Metrology accelerate in-line quality control for both front- and back-end processes

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Presented by Samuel Lesko, Ph.D., Dir. of Technology and Apps Development, Bruker Nano Surfaces & Metrology (December 17, 2019)

       PRESENTATION HIGHLIGHTS:

  • [00:03:46] Review of non-contact interferometric profiler components, modes, and attributes
  • [00:16:15] Front-end (FEOL) quality control solutions for semiconductor manufacturing
  • [00:29:45] Back-end (BEOL) quality control solutions for semiconductor manufacturing


       LIVE AUDIENCE Q&A:

  • [00:46:43] What lateral resolution can you expect when scanning RDL layers?
  • [00:47:53] What is the layer thickness limit for characterization of transparent layers?
  • [00:49:06] How do you cope with different refractive indexes or oxide thicknesses for CMP measurements of films? 

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