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Thin Film Interface Adhesion Characterization for Industrial Applications

Thin Film Measurements Webinar Series Part 2/4. Presented by Pal-Jen Wei, Ph.D., Applications Scientist, Bruker

In this second session of our four-part Thin Film Characterization Webinar Series, viewers discover why and how to use nanoindentation and nanoscratch testing to measure the adhesion of thin film samples and the techniques and tools for navigating the challenges posed by non-ideal experimental conditions.

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▶ WATCH ON-DEMAND | 1 Hr 10 MINUTES

Thin Film Interface Adhesion Characterization For Industrial Applications

Presented by Presented by PJ Wei, Ph.D., Applications Scientist, Bruker (August 26, 2021)

_{PRESENTATION HIGHLIGHTS}

[00:03:08] Methods for collecting thin film adhesion measurements
[00:15:04] Inducing delamination through nanoindentation and nanoscratch testing for high-confidence failure mode analysis
[00:24:18] Correlating results collected by nanoindentation and nanoscratch techniques
[00:26:19] Case study: Indentation-induced delamination with the Hysitron TI-980 and the Hysitron XPM system upgrade
[00:33:07] Use case study: The effect of surface roughness on nanoindentation and nanoscratch test accuracy and solutions for negating it
[00:47:17] Case study: Indentation-induced delamination with the Hysitron XPM system upgrade and xSol heating stage at elevated temperature