Challenges in Thin Film Hardness, Modulus Measurement and Solutions
Thin Film Measurements Webinar Series Part 1/4. Presented by Pal-Jen Wei, Ph.D., Applications Scientist, Bruker
In this first session of our four-part Thin Film Characterization Webinar Series, viewers learn how instrumented indentation solves the challenges of measuring the mechanical properties of thin films at the nano-scale—and how Bruker's solutions for instrumented nanoindentation provide unmatched imaging and metrology performance.
Challenges In Thin Film Hardness, Modulus Measurement And Solutions
PRESENTATION HIGHLIGHTS
- [00:03:06] Introduction to mechanical properties of thin films and related metrology methods
- [00:06:07] Overview of instrumented indentation for testing nano-scale properties of thin films
- [00:11:32] Challenges of profiling the intrinsic mechanical properties of ultra-thin films
- [00:19:55] Solutions for characterizing the intrinsic mechanical properties of ultra-thin films
- [00:28:36] Bruker's solutions for nano-to-macro scale measurement of thin films and coatings
Q&A
LIVE Q&A WITH THE PRESENTER
- [00:35:30] Is there any relationship between the elasticity and plasticity of the sample?
- [00:40:10] For SPM mode, are there any differences if the probe tip is indented in the same position or a different position?
- [00:42:26] What technique/tool can be used to measure wafer-to-wafer bonding samples?
- [00:45:05] What sample thickness range can be checked using TEM and SEM?
- [00:49:50] Why plot displacement on the X-axis?
- [00:54:08] What is the sample thickness limit when measuring hardness?
