Rhazer-III
产线上的光罩雾度缓解与去除
Rhazer III
布鲁克Rhazer-III®系统是专门为晶圆制造厂设计的，引入了创新的清洁与干燥技术，有效实现晶圆生产过程中的雾度消除与管理。采用这一先进技术，不仅能提升产品品质，还能确保生产的高效性和稳定性，是您理想的晶圆制造伙伴。
光致缺陷修理（减轻雾度）
光致微污染（雾化现象）在光罩产业已成为一个日益普遍且成本高昂的问题。尽管最新的湿法清洗技术及环境控制手段能在一定程度上延缓晶圆曝光过程中的雾化形成速度，但它们并未展现出能够彻底预防雾化的潜力。为此，Bruker 推出了创新性的 Rhazer-III® 系统——专门为晶圆制造厂量身定制，以实现高效、即时的雾化消除与管理。
Bruker Rhazer-III® 系统采用无接触、无水的清洁方式，不仅避免了因移除保护膜带来的复杂操作，还能确保在不对光罩吸收层造成任何损伤的前提下进行处理，同时保持原有的光学性能不变，包括相位、透射率及关键尺寸等重要参数。这意味着您可以在不影响生产流程的情况下，根据实际需要随时对掩模板进行清洁维护，从而大幅提升生产效率与产品可靠性。
主要性能特点
Increased Lithography Line Efficiency:
- Dry process - no pellicle removal
- Fast turnaround - full reticle clean
- Full control - retcles never leave the wafer fab
- Fewer cleans - no haze formation in storage
Fully Automated Operation:
- SMIF & Overhead Track compatible; RFID/OCR/Barcode readers
- SECS/GEM compatible
- Robotic handling including mask flipper
- Easy to operate; highly user friendly GUI
Extends Mask Lifetime:
- No absorber damage
- No CD, phase or transmission variance
- No added chemical residues
- No limit to number of cleans
Wafer Fab Cost Savings:
- Less wasted scanner downtime waiting for masks
- Very low cost mask cleans
- Fewer duplicate masks needed
- Extended interval between defect inspections
- Reduced haze-related wafer losses
"Green" Technology:
- No acids, solvents or de-ionized water
- No harmful effluents or waste management
- Low energy consumption (7kW @ 208V AC)
- Small system footprint (1.24m x 2.31m)
Results
Support
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.