Atomic Force Microscopy for Advanced Surface Characterization and Metrology for the Semiconductor Industry
Unlocking Actionable Data and Enhanced Yield with AFM: Techniques and Case Studies for Node and Wafer Processing
Join us for this on-demand webinar on advanced surface characterization and metrology solutions for the semiconductor industry. Learn about the techniques available for in-line process control and the nanoscale characterization of the topography and advanced physical properties of semiconductor materials and devices.
Bruker’s atomic force microscopy (AFM)-based techniques set industry-leading standards, delivering highest accuracy and non-destructive, high-throughput solutions for R&D and fully automated in-line process control.
Webinar Summary
In this webinar, we illustrate how AFM can be applied in modern node and wafer processing steps and front-end/back-end applications to achieve actionable data and enhanced yield. We also provide an overview of high-resolution imaging, profiling, and metrology techniques, illustrated with a variety of case studies.
Topics include:
- Assessment of surface roughness, bonding/hybrid bonding applications, and CMP processes
- Large-scale metrology on the millimeter scale, for full die, field effect, and bevel edges
- Critical dimension (CD) and sidewall metrology of lines, trenches, and vias
- Fully automated characterization of mechanical and electrical properties, carrier profiling, reliability testing, and failure analysis of nanoscale defects on blanket and patterned wafers
- Photothermal NanoIR spectroscopy for chemical identification and mapping on the nanoscale
- AFM-based defect manipulation and repair for photomask
Find out more about the technology featured in this webinar or our other solutions for AFM:
Featured Products and Technology
Speakers
Peter De Wolf, Ph.D.,
Director of Technology & Application Development
Sean Hand,
Senior Staff Applications Scientist, Bruker
