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Surface Characterization of Semiconductors: An Overview, from Topography to Advanced Physical Properties

Learn about Bruker’s high-performance metrology techniques for the nanometer-scale surface characterization of semiconductor materials and devices

Introduction to Bruker's Portfolio of Solutions for Semiconductor Characterization

Presented by Peter De Wolf, Ph.D., WW Applications Director, Bruker (April 21, 2021)

       PRESENTATION HIGHLIGHTS:

  • [00:01:28] Webinar Agenda

Bruker Semiconductor Products Portfolio

  • [00:04:15] 3D Optical and Stylus Metrology
  • [00:04:55] Tribology and Mechanical Testing
  • [00:05:24] NanoIndentation
  • [00:05:58] Atomic Force Microscopy

Semiconductor M3D Metrology Using Optical and Stylus Profiling

Presented by Samuel Lesko, Ph.D., Technology and Applications Development Director, Bruker; and Michael Febvre, Ph.D., Application Manager, Bruker EMEA (April 21, 2021)

       PRESENTATION HIGHLIGHTS:

  • [00:00:00] Introduction to Stylus and Optical Profilometry

Stylus Profiler Applications

  • [00:05:05] Step Height and Thin Film
  • [00:07:21] Bow and Thin Film Stress

Optical Profiler Applications

  • [00:14:16] Packaging & Fan-Out
  • [00:31:02] CMP Optimization & Die Flatness

CMP Tribology

Presented by Udo Volz, Ph.D., Applications Scientist, Bruker (April 21, 2021)

       PRESENTATION HIGHLIGHTS:

  • [00:00:00] Introduction to Chemical-Mechanical Polishing for semiconductors
  • [00:01:43] Fundamentals of Chemical-Mechanical Polishing
  • [00:02:55] Important Factors in Chemical-Mechanical Polishing
  • [00:04:10] Bruker Tribolab CMP Tester
  • [00:09:17] CMP Application Examples
  • [00:14:51] Summary

Mechanical Characterization of Semiconductor Samples and Devices

Presented by Ude Hangen, Ph.D., Nanomechanical Instruments Applications Manager, Bruker (April 21, 2021)

       PRESENTATION HIGHLIGHTS:

  • [00:00:24] Nanoindentation Basics
  • [00:02:23] Mechanical Testing Landscape
  • [00:05:20] Expansion of TSV - in situ observation
  • [00:07:27] Mechanical Property Testing
  • [00:13:31] Advanced Testing
  • [00:16:41] Bruker's Hysitron Nanoindenter Product Portfolio

Highest Resolution 3D Metrology and Advanced Physical Property Characterization of Semiconductor Samples and Devices

Presented by Vishal Panchal, Ph.D., Applications Scientist, Bruker; and Hartmut Stadler, Ph.D., Applications Scientist, Bruker (April 21, 2021)

PRESENTATION HIGHLIGHTS:

High-Resolution Topography

  • [00:01:08] Principles of AFM
  • [00:02:20] Surface Topography Imaging
  • [00:05:01] Dimensional Metrology
  • [00:10:11] Defect Review/inspection
  • [00:13:11] Practical Demonstration

Beyond Topography

  • [00:20:06] Nano-Electrical
  • [00:26:06] Nano-Mechanical
  • [00:29:54] Nano-Chemical

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