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▶ Watch On-Demand | 50 Minutes

On-Demand Session: Automated AFM for Inline Hybrid Bonding Metrology in the Semiconductor Industry

Learn how automated AFM can be applied to the most current hybrid bonding technology nodes and wafer processing steps

Watch Individual Sessions:

Introduction; Recorded December 4, 2024
Watch Now | 30 Minutes

Automated AFM for Inline Hybrid Bonding Metrology in the Semiconductor Industry

 Presented by Sean Hand, Senior Application Scientist, Bruker (December 4, 2024)

       PRESENTATION HIGHLIGHTS:

  • [00:01:20] What is hybrid bonding
  • [00:02:20] Hybrid bonding process overview and challenges
  • [00:05:25] Surface metrology and hybrid bonding
  • [00:07:45] Introduction to the InSight AFP with the hybrid bonding package
  • [00:13:20] Hybrid bonding AFM metrology
  • [00:20:48] Hybrid bonding profilometry and large area scanning
  • [00:26:05] Bevel edge metrology for hybrid bonding
  • [00:29:19] Conclusion
Watch Now | 20 Minutes

Question and Answer

       PRESENTATION HIGHLIGHTS:

  • [00:00:00] Is the hybrid bonding probe developed specifically for the InSight AFP?
  • [00:02:22] How do different substrates, properties, stiffness, and materials affect the measurements?
  • [00:05:52] How do we measure bevel where topography is larger than the Z scan range?
  • [00:07:35] How long does it take to scan a full die?
  • [00:09:47] Have you ever seen electrostatic charge due to material properties and how does that affect the measurements?
  • ....

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