This live webinar will focus on applying Automated Atomic Force Microscopy (AFM) in inline metrology of hybrid bonding in the semiconductor industry. Bruker’s fully automated AFM solutions enable the highly accurate, non-destructive, nanoscale characterization of surfaces, while delivering high-throughput data for inline process control and actionable data for hybrid bonding yield enhancement.
Find out more about the technology featured in this webinar or our other solutions for inline metrology:
In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed:
Don’t miss the opportunity to speak to our experts in the Q&A session!
Date: Thursday, November 21
Time: 8AM PST | 11AM EST | 5PM CET
Location: Online
Featured Technologies:
Sean Hand,
Senior Staff Applications Scientist, Bruker
Ingo Schmitz, Ph.D.
Technical Marketing Engineer, Bruker