Thin Film Measurements Webinar Series

       _{PRESENTATION HIGHLIGHTS}

• [00:03:06] Introduction to mechanical properties of thin films and related metrology methods
• [00:06:07] Overview of instrumented indentation for testing nano-scale properties of thin films
• [00:11:32] Challenges of profiling the intrinsic mechanical properties of ultra-thin films
• [00:19:55] Solutions for characterizing the intrinsic mechanical properties of ultra-thin films
• [00:28:36] Bruker's solutions for nano-to-macro scale measurement of thin films and coatings

       _{LIVE Q&A WITH THE PRESENTER}

• [00:35:30] Is there any relationship between the elasticity and plasticity of the sample?
• [00:40:10] For SPM mode, are there any differences if the probe tip is indented in the same position or a different position?
• [00:42:26] What technique/tool can be used to measure wafer-to-wafer bonding samples?
• [00:45:05] What sample thickness range can be checked using TEM and SEM?
• [00:49:50] Why plot displacement on the X-axis?
• [00:54:08] What is the sample thickness limit when measuring hardness?

       _{PRESENTATION HIGHLIGHTS}

• [00:03:08] Introduction to the different methods for collecting thin film adhesion measurements
• [00:15:04] Inducing delamination through nanoindentation and nanoscratch testing for high-confidence failure mode analysis
• [00:24:18] Correlating results collected by nanoindentation and nanoscratch techniques
• [00:26:19] Use case study: Indentation-induced delamination with the Hysitron TI-980 and the Hysitron XPM system upgrade
• [00:33:07] Use case study: The effect of surface roughness on nanoindentation and nanoscratch test accuracy and solutions for negating it
• [00:47:17] Use case study: Indentation-induced delamination with the Hysitron XPM system upgrade and xSol heating stage at elevated temperature
• [01:00:00] Preview of the next webinar in the Thin Film Measurements series.

       _{PRESENTATION HIGHLIGHTS}

• [00:03:14] Introduction to thin film cohesion and fracture toughness measurement
• [00:10:06] Fracture toughness calculation by hardness mapping and in-plane stress measurement
•  [00:14:00] Calculating fracture toughness on vertical interfaces using nanoscratch and nanoindentation methods
• [00:26:27] Calculating fracture toughness on horizontal interface by in-situ methods
• [00:42:12] Review of Bruker solutions
   

       _{LIVE Q&A WITH THE PRESENTER}

• [00:46:23] When using the nanoscratch method, is the Normal force kept constant or does it increase during the measurement?
• [00:47:20] Could you talk more about the modes used to measure fracture toughness? Are they related to each other?
• [00:51:12] Is it possible to measure fracture toughness values using scratch testing at a higher load (ex. 20 N - 200 N)?

_{PRESENTATION HIGHLIGHTS}

• [00:02:54] Introduction to the xSol in-operando environmental chamber
• [00:04:24] Principles of measuring nanomechanical properties at high temperature
• [00:14:22] Use case study: Measuring glass transition temperatures
• [00:23: 54] Navigating barriers to arrurate linear coefficient of thermal expansion for high temperature measurements
• [00:34:57] Principles of measuring nanomechanical properties at low temperatures
• [00:45:15] Principles of measuring in humid environments and vacuums
• [00:50:30] Introduction to Hysitron PI 89 and 800* sample heating option for humidity and temperature control
• [01:02:04] Summary of all Thin Film Measurements Series webinars