全自动原子力量测方案 

InSight CAP

晶圆制造中十分关键的在线量测可在几分钟内完成,特别适用于蚀刻和CMP的技术开发和过程控制

适用于Etch和CMP的非破坏性量测技术

结合了高性能的轮廓仪和原子力显微镜的紧凑型机器

Bruker的InSight CAP自动化原子力分析仪是专为半导体FAB和IDM设计的紧凑量测平台,通常接入CMP,沉积和蚀刻节点的过程控制。其灵活的配置支持从100毫米到300毫米的各类晶圆尺寸,并为广泛的终端应用实现高精度测量。从高精密的实验室到全自动的晶圆厂,InSight CAP是最具成本效益的在线量测解决方案。 

< 0.5 nm
长期动态复现性(Dynamic Reproducibility)
精确稳定且直接的在线量测保证关键工艺决策 
亚纳米级别
全自动CMP量测方案的灵敏度
专门的凹陷和侵蚀(Dishing & Erosion)量测方案极大加速了CMP的过程控制和工艺开发 
< 20 nm
轮廓平整度(Profiling Flatness over 26mm)
CMP后的平整表面测量与高精度成像,有助于EUV光刻工艺开发和过程控制
Features

在线量测快速完成,适用于刻蚀和CMP工艺的开发和过程控制

先进节点中,多重图案光刻技术对CMP工艺提出了纳米级别的控制要求,以满足焦深(depth-of-focus)需求。InSight CAP基于最新一代的原子力显微镜(AFM)平台而构建,改进了系统平整度(Flatness),可在大于65微米的X/Y扫描范围内控制平整度至10 nm以下。
系统配备的NanoScope® V 64位AFM控制器实现了5倍以上探针调谐速度(Cantilever Tuning)和表面探测速度(Engage Performance),从而大大提高了生产效率,增强了系统可靠性。布鲁克专利的自适应扫描模式(DTMode)也有助于实现更快的扫描和更准确的测量精度。结合这些高级特性,InSight CAP高分辨轮廓仪能在更宏观的尺度对CMP后的凹陷和侵蚀(Dishing and Erosion)实现埃米级测量。

灵活的配置使InSight CAP支持从100毫米到300毫米的各类晶圆尺寸,并为广泛的终端应用实现高精度测量。从高精密的实验室到全自动的晶圆厂,InSight CAP都最具成本效益的在线量测解决方案。

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