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On-Demand Session: Atomic Force Microscopy for Advanced Surface Characterization and Metrology for the Semiconductor Industry

Learn more about Advanced Surface Characterization and Metrology Solutions for the Semiconductor Industry

Watch Individual Sessions:

Watch Now | 22 Minutes

AFM for Semi Industry - From the Lab

Presented by Peter De Wolf, Ph.D., Director of Technology and Application Development, Bruker (April 16, 2024)

       PRESENTATION HIGHLIGHTS:

  • [00:01:10] Principle of Atomic Force Microscopy
  • [00:02:08] Surface Topography Imaging - Key Aspects
  • [00:04:23] AFM Hardware 
  • [00:05:40] Surface Topography Imaging - Typical Examples
  • [00:07:20] Surface Topography Imaging - Key Aspects
  • [00:08:45] Dimensional Metrology of High Aspect Ratio Structures
  • [00:10:15] Property Measurements methods
Watch Now | 25 Minutes

AFM for Semi Industry - To Fab

Presented by Sean Hand, Senior Staff Application Scientist, Bruker (April 16, 2024)

       PRESENTATION HIGHLIGHTS:

  • [00:00:00] Introduction to Automated AFM
  • [00:02:58] Bruker Semiconductor Product Portfolio
  • [00:03:23] Automated AFM Solutions for Wafer
  • [00:11:25] Modes and Applications for Wafer
  • [00:22:29] Photomask Solutions - Mask Metrology and Repair
Watch Now | 25 Minutes

Question and Answer

       PRESENTATION HIGHLIGHTS:

  • [00:00:00] Which cantilevers are better for measuring the mechanical properties of semiconductors (200 Giga Pass Modulus)
  • [00:03:05] Can you explain in detail the deep trench mode, and how it differs from regular scanning mode?
  • [00:04:15] Why was Tapping mode used over other methods for CMP application?
  • [00:05:30] How do we compare quantitatively to other bulk techniques?

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