Bruker Introduces Next-Generation Nanomechanical Test System

COLUMBUS, Ohio, October 2, 2023 – At the annual Materials Science and Technology (MS&T23) conference, Bruker Corporation (Nasdaq: BRKR) today announced the release of the Hysitron TI 990 TriboIndenter^®, which brings superior levels of performance, automation, and productivity to nanomechanical testing. TI 990 is a comprehensive advancement of Bruker’s industry-leading TriboIndenter platform with new measurement modes, 2X faster testing throughput, and a larger 200mm x 300mm testing area. These enhancements deliver tangible benefits across a variety of applications and markets, for example, improved accuracy for nanoscale testing of polymer thin films, increased throughput for combinatorial materials science, and multi-measurement analysis of full 300-mm semiconductor wafers. With its combination of performance, usability, and flexibility, TI 990 is an ideal characterization solution for polymer research, alloy development, and semiconductor devices.

“Bruker’s latest system includes powerful new tool control, particularly its new mixed-mode feedback control, which opens research possibilities at both extremes of the time domain,” said Prof. Nathan Mara, University of Minnesota Twin Cities. “It’s impressive to see how the boundaries for new experiments at small length scales are being expanded.”

“Every aspect of TI 990 was reimagined to optimize the testing process and potential,” added Dr. Oden Warren, General Manager of Bruker’s nanomechanical testing business. “Our engineers have made everything better, from increased measurement flexibility to easier system setup and more streamlined operation. I look forward to seeing the breakthroughs our customers are going to make with this new system.”

Utilizing multiple patented and proprietary technologies, TI 990 enables quantitative mechanical and tribological characterization at the nanoscale. Every aspect of the measurement and analysis process features updated technology, including the new Performech III controller, advanced feedback control modes, next-generation nanoDMA IV dynamic nanoindentation, and XPM II high-speed mechanical property mapping. Nearly any sample can be mounted using the universal sample chuck and measured with a larger testable area. Top-view sample navigation streamlines system setup in the new TriboScan 12 software, allowing for simplified remote operation of the instrument.